Product Details
DESCRIPTION
Rugged glass SOD64 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack
• Also available with preformed leads for easy insertion.
Product Description
| TYPE# | DESCRIPTION |
| ANSC PART# | ANSC- BYV28-200 |
| Ihs Manufacturer | NXP |
| Package Description | HERMETIC SEALED, GLASS PACKAGE-2 |
| Pin Count | 2 |
| Samacsys Manufacturer | NXP |
| Application | GENERAL PURPOSE |
| Case Connection | ISOLATED |
| Configuration | SINGLE |
| Diode Element Material | SILICON |
| Diode Type | RECTIFIER DIODE |
| Forward Voltage-Max (VF) | 1.1 V |
| Non-rep Pk Forward Current-Max | 90 A |
| Number of Elements | 1 |
| Number of Phases | 1 |
| Number of Terminals | 2 |
| Operating Temperature-Max | 175 °C |
| Operating Temperature-Min | -65 °C |
| Output Current-Max | 1.9 A |
| Package Body Material | GLASS |
| Package Shape | ELLIPTICAL |
| Package Style | LONG FORM |
| Qualification Status | Not Qualified |
| Rep Pk Reverse Voltage-Max | 200 V |
| Reverse Current-Max | 1 µA |
| Reverse Recovery Time-Max | 0.025 µs |
| Surface Mount | NO |
| Technology | AVALANCHE |
| Terminal Form | WIRE |
| Terminal Position | AXIAL |
Product Photos
Product datasheet
For more information, please download
Payment&Transportation
Official Certificate&Certificate
Standard packaging
Multiple product supply
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