Product Details
| General description Single general-purpose switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. Features ● High switching speed: trr ≤ 50 ns ● Low leakage current ● Low capacitance: Cd ≤ 5 pF ● Small hermetically sealed glass SMD package Applications ● High-speed switching ● General-purpose switching ● Voltage clamping ● Reverse polarity protection |
Product Description
| Type# | Description |
| ANSC PART# | ANSC-BAV103 |
| Manufacturer | / |
| Package Description | HERMETIC SEALED, GLASS PACKAGE-2 |
| Pin Count | 2 |
| Samacsys Manufacturer | / |
| Case Connection | ISOLATED |
| Configuration | SINGLE |
| Diode Element Material | SILICON |
| Diode Type | RECTIFIER DIODE |
| Forward Voltage-Max (VF) | 1.25 V |
| Moisture Sensitivity Level | 1 |
| Non-rep Pk Forward Current-Max | 5 A |
| Number of Elements | 1 |
| Number of Phases | 1 |
| Number of Terminals | 2 |
| Operating Temperature-Max | 175 °C |
| Output Current-Max | 0.25 A |
| Package Body Material | GLASS |
| Package Shape | ROUND |
| Package Style | LONG FORM |
| Peak Reflow Temperature (Cel) | 260 |
| Power Dissipation-Max | 0.4 W |
| Qualification Status | Not Qualified |
| Rep Pk Reverse Voltage-Max | 250 V |
| Reverse Current-Max | 0.1 µA |
| Reverse Recovery Time-Max | 0.05 µs |
| Surface Mount | YES |
| Terminal Finish | Tin (Sn) |
| Terminal Form | WRAP AROUND |
| Terminal Position | END |
| Time@Peak Reflow Temperature-Max (s) | 30 |
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