Product Description
| Type# | Description |
| ANSC PART# | ANSC - XC2S50E-6FT256C |
| Ihs Manufacturer | / |
| Part Package Code | BGA |
| Package Description | FBGA-256 |
| Pin Count | 256 |
| Additional Feature | MAXIMUM USABLE GATES = 50000 |
| Clock Frequency-Max | 357 MHz |
| Combinatorial Delay of a CLB-Max | 0.47 ns |
| Length | 17 mm |
| Moisture Sensitivity Level | 3 |
| Number of CLBs | 384 |
| Number of Equivalent Gates | 23000 |
| Number of Inputs | 182 |
| Number of Logic Cells | 1728 |
| Number of Outputs | 182 |
| Number of Terminals | 256 |
| Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | |
| Organization | 384 CLBS, 23000 GATES |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA256,16X16,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 240 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2 mm |
| Supply Voltage-Max | 1.89 V |
| Supply Voltage-Min | 1.71 V |
| Supply Voltage-Nom | 1.8 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL EXTENDED |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Terminal Form | BALL |
| Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 17 mm |
Product Photos
