Product Descriptions
Ra-01SC-P is a LoRa series module. This module is used for ultra long distance spread spectrum communication, and its RF chip LLCC68+mainly uses LoRar remote modem for ultra long distance spread spectrum communication. It has strong anti-interference ability and can minimize current consumption. With the help of SEMTECH's LoRaTM patented modulation technology, the module is equipped with power amplifier (PA) and low noise amplifier (LNA), with high sensitivity exceeding -137dBm and transmission power of+29dBm. It has a long transmission distance and high reliability. Compared to traditional modulation techniques, LoRaT modulation technology also has significant advantages in terms of anti blocking and selection, solving the problem that traditional design solutions cannot simultaneously consider distance, anti-interference, and power consumption.
Product Specifications
| 模组型号 Module model | Ra-01SC-P |
| 模组封装 Module packaging | SMD-16 |
| 尺寸(mm) Size(mm) | 17.0*16.0*3.2(±0.2)MM |
| 天线形式 Antenna form | 兼容半孔焊盘/通孔焊盘/IPEX 座子 Compatible with half hole solder pads/through-hole solder pads/IPEX sockets |
| 频谱范围 Spectrum range | 410*525MHz |
| 工作环境 Work environment | -40℃~85 ℃ |
| 存储环境 Storage environment | -40℃~125°C,<90%RH |
| 供电范围 Power supply range | 供电电压 3.0~3.6V，典型值 3.3V，电流大于1A Supply voltage of 3.0~3.6V, typical value of 3.3V, current greater than 1A |
| 支持接口 Support interfaces | SPI |
| 可编程比特率 Programmable Bit Rate | Up to 300kbps |
The Ra-01SC-P module has a total of 16 pins connected, as shown in the pin diagram. The pin function definition table is the interface definition:
| 脚序 Foot sequence | 名称 Name | 功能说明 Function Description |
| 1 | ANT | 接天线 Connect antenna |
| 2 | GND | 接地 Grounding |
| 3 | 3V3 | 典型值3.3V供电 Typical 3.3V power supply |
| 4 | RESET | 复位脚 Reset foot |
| 5 | CPS | FEM 芯片 TX直通使能脚，发射模式时该脚低电平RF不经 PA 放大直接输出，内部默认上拉 The FEM chip TX enable pin has a low level RF output without PA amplification during transmission mode, and is internally pulled up by default |
| 6 | DIO1 | 数字IO1软件配置 Digital IO1 software configuration |
| 7 | DIO2 | 数字IO2软件配置 Digital IO2 software configuration |
| 8 | DIO3 | 数字IO3软件配置 Digital IO3 software configuration |
| 9 | GND | 接地 Grounding |
| 10 | BUSY | 状态指示灯引脚 Status indicator pin |
| 11 | RF_EN | FEM芯片使能脚，高电平有效，模组内部默认上拉；高电平处于工作状态，低电平处于睡眠状态 FEM chip enable pin, high level effective, default pull-up inside the module; High level is in working state, low level is in sleep state |
| 12 | SCK | SPI时钟输入 SPI clock input |
| 13 | MISO | SPI数据输出 SPI data output |
| 14 | MOSI | SPI数据输入 SPI data input |
| 15 | NSS | SPI片选输入 SPI chip selection input |
| 16 | GND | 接地 Grounding |
| EPAD | GND | 接地，需可靠接地，利于散热 Grounding, reliable grounding is required to facilitate heat dissipation |
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