R5F21284JSP Product details   

Overview

These MCUs are fabricated using a high-performance silicon gate CMOS process, 

embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. 

It implements sophisticated instructions for a high level of instruction efficiency. 

With 1 Mbyte of address space, they are capable of executing instructions at high speed. 

Furthermore, the R8C/29 Group has on-chip data flash (1 KB × 2 blocks).

Applications

Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc

Product Description

Actual image of the product                

Product datasheet

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Payment&Transportation

Official Certificate&Certificate

Standard packaging

Multiple product supply

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