Aerosemi(航天民芯)

High-speed and high-precision ADC and DAC chips/AC/DC converters, audio power amplifiers, LED TV special chips, etc.

2023-11-30

Aeroflex

PXI embedded controller, GPS simulator, RF frequency synthesizer, etc.

2023-11-30

Aeris

RF/IF and RFID

2023-11-30

AEM科技

ECU, chip inductors and magnetic beads, fuses, static suppressors, multilayer varistors

2023-11-30

AEL Crystals

Quartz crystals, oscillators, filters, surface acoustic wave devices, MEMS products, antennas, dielectric filters, etc.

2023-11-29

B&B Electronics

Ethernet and communication modules, RF/wireless modules, fuses, surge suppressors, D-Sub connectors

2023-11-29

B B Battery

Battery products

2023-11-29

Aearo Technologies

Fans, thermal management, hardware, fasteners, accessories application areas

2023-11-29

SK海力士计划将下一代HBM采用2.5D扇出封装技术

SK海力士正准备推出“2.5D扇出”封装，作为其下一代存储半导体技术。SK海力士今年在高带宽内存（HBM）领域取得了成功，对下一代芯片技术领域充满信心，似乎正在通过开发“专业”内存产品来确保其技术领先地位。根据韩媒 Business Korea 报道，SK 海力士正准备将 2.5D 扇出封装技术集成到其继 HBM 之后的下一代 DRAM 中。

2023-11-29

Advantech

Including software, hardware, system integration solutions for automation, embedded computers and intelligent services, as well as computer peripheral products such as memory, MCU, CPU, power supply, etc.

2023-11-28

Advanced Thermal Solutions(ATS)

Radiators, LED devices, transformers and other application fields

2023-11-28

Advanced Power Electronics(APEC)

MOSFETs, IGBTs and power ICs

2023-11-28

Advanced Linear Devices

Ultra-low power, high-precision CMOS analog integrated circuits, related board-level products and energy harvesting modules and accessories

2023-11-28

Advanced Interconnections

BGA socket systems, Peel-A-Way, board-to-board connectors, package converters, IC sockets and converters

2023-11-28

ADLINK Technology

USB data acquisition modules, PXI/PXIe and modular instruments, industrial-grade communication and remote control I/O, image capture cards/video capture cards, SEMA cloud, connectors, sensors

2023-11-28

ADEUNIS RF

Wireless modems, RF modules, etc

2023-11-28

三菱电机与安世合作开发SiC功率半导体

近日，日本三菱电机、安世半导体（Nexperia）宣布，将联合开发高效的碳化硅（SiC）MOSFET分立产品功率半导体。三菱电机将研发、供应SiC-MOSFET芯片给Nexperia，而Nexperia将研发搭载三菱电机芯片的SiC分离式组件（Discrete）。

2023-11-28

Adesto Technologies

Serial Flash and Conductive Bridge RAM (CBRAM) Memory

2023-11-27

ADC

FP optical communication components

2023-11-27

A-Data Technology

Memory, flash drive/flash card, SSD solid state drive and mobile hard drive

2023-11-27